Thin-film magnetic head material and method of manufacturing same and method of manufacturing thin-film magnetic head

ABSTRACT

A manufacturing method is provided for manufacturing a head material including: a plurality of rows of head-to-be sections to be thin-film magnetic heads; an inter-row cutting section provided to be a position at which adjacent ones of the rows are to be separated; and an intra-row cutting section provided to be a position at which adjacent ones of the head-to-be sections in each of the rows are to be separated. The method includes the steps of: providing a detection element to be used for detecting an amount of processing when specific processing is performed on the head material; an electrode for electrically connecting the detection element to an external device; and a conductor for electrically connecting the electrode to the detection element; and forming the electrode in the inter-row section.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a thin-film magnetic head materialincluding a detection element for detecting an amount of processing anda method of manufacturing such a head material and to a method ofmanufacturing thin-film magnetic heads through the use of a detectionelement.

2. Description of the Related Art

A flying-type thin-film magnetic head used for a magnetic disk deviceand so on is generally made up of a thin-film magnetic head slider (thatmay be simply called a slider) having a thin-film magnetic head elementprovided at the trailing edge of the slider. The slider generallycomprises a rail whose surface functions as a medium facing surface (anair bearing surface) and a tapered section or a step near the end on theair inflow side. The rail flies slightly above the surface of arecording medium such as a magnetic disk by means of air flow from thetapered section or step.

A thin-film magnetic head element generally used is a composite-typeelement made up of layers of an induction magnetic transducer forwriting and a magnetoresistive (MR) element for reading.

In general, such thin-film magnetic head sliders are formed throughcutting a wafer in one direction in which sections to be sliders (calledslider sections in the following description) each including a thin-filmmagnetic head element are arranged in a plurality of rows. A blockcalled a bar in which the slider sections are arranged in a row isthereby formed. Rails are then formed in the bar and the bar is cut intothe sliders.

The manufacturing process of the sliders includes a step of processingthe medium facing surface of the bar, that is, grinding or lapping themedium facing surface and a step of cutting the wafer into the bars. Theorder of the step of processing the medium facing surface and the stepof cutting the wafer into the bars depends on methods of processing themedium facing surface and cutting the wafer, as described later.

In the step of processing the medium facing surface, it is required thatthe MR height and the throat height of the thin-film magnetic headelement formed in the bar each fall within a tolerance range and thatprocessing accuracy of the surface processed falls within a tolerancerange. The MR height is the length (height) between the end of the MRelement close to the medium facing surface and the opposite end. Thethroat height is the length (height) of the magnetic pole of aninduction magnetic transducer.

In the step of processing the medium facing surface, in order toprecisely control the MR height and throat height of each thin-filmmagnetic head element included in a bar, one of the methods taken is toform a detection element (that may be called a lapping guide) in a waferin advance for detecting an amount of processing. A signal outputtedfrom the detection element is monitored during the step of processingthe medium facing surface and the processing is controlled with highaccuracy, in response to the output signal. The detection element may bea resistance element whose resistance value changes in response to itsdimensions.

To monitor a signal outputted from the detection element in the step ofprocessing the medium facing surface, it is required to form anelectrode for monitoring and a lead (conductor) for monitoring in thewafer in advance, in addition to the detection element. The electrode isused for electrically connecting the detection element to a controllerof an external processing apparatus. The lead is used for electricallyconnecting the electrode to the detection element.

FIG. 13 shows an example of arrangement of detection elements, andelectrodes and leads for monitoring in a wafer used for manufacturingthin-film magnetic heads of related art. In this example, thin-filmmagnetic head elements 101 are aligned in a plurality of rows in thewafer 100. The head elements 101 each include: an element section 102including an induction-type magnetic transducer and an MR element; and aplurality of electrodes 103 for electrically connecting the elementsection 102 to an external device. In the wafer 100 in the example shownin FIG. 13, between every adjacent head elements 101 in each row, thereare a detection element 111 for detecting an amount of processing, twoelectrodes 112 a and 112 b for monitoring, and two leads 113 a and 113 bfor monitoring that electrically connect the electrodes 112 a and 112 bto each other.

FIG. 14 shows another example of arrangement of detection elements, andelectrodes and leads for monitoring in a wafer used for manufacturingthin-film magnetic heads of related art. This example may be the onedisclosed in Japanese Patent Application Laid-open Hei 8-287424 (1996).In this example, as in the example shown in FIG. 13, the detectionelement 111, the two electrodes 112 a and 112 b for monitoring, and thetwo leads 113 a and 113 b for monitoring are placed between everyadjacent head elements 101 in each row in the wafer 100. One of theelectrodes 112 a is used for grounding and functions as one of theelectrodes 103 of the head element 101 as well.

In the example shown in FIG. 13, the detection element 111, theelectrodes 112 a and 112 b, and the leads 113 a and 113 b are placedbetween every adjacent head elements 101 in each row. As a result, thepitch of the head elements 101 in each row is increase by the spaceoccupied by the detection element, the electrodes and the leads,compared to a case where none of these is placed between every adjacenthead elements. Consequently, the number of thin-film magnetic headelements obtained from a given length of bar is reduced.

In the example shown in FIG. 14, compared to the one shown in FIG. 13,the pitch of the head elements 101 in each row is reduced and the numberof thin-film magnetic head elements obtained from a given length of baris thereby increased. However, in this example, too, the electrode 112 bis additionally provided between every adjacent head elements 101 ineach row. Therefore, the pitch of the head elements 101 in each row isstill greater, and the number of head elements obtained from a givenlength of bar is reduced, compared to a case where the electrode 112 bis not placed. In particular, since the electrode such as the electrode112 b is required to be connected to a bonding wire, it is necessary tomaintain the electrode at a certain size. The pitch is therefore furtherrequired to be increased. For example, if the diameter of the bondingwire is about 30 μm, the length of one side of the electrode 112 b isrequired to be about 100 μm.

In the example shown in FIG. 14, the electrode 112 a functions as one ofthe electrodes 103 of the thin-film magnetic head element 101, too. As aresult, if the bar is cut at the detection element 111 for dividing thebar into head elements (sliders), part of the lead for monitoringremains exposed outside. The part of the lead may catch noises and causestatic damage.

SUMMARY OF THE INVENTION

It is a first object of the invention to provide a thin-film magnetichead material and a method of manufacturing the same and a method ofmanufacturing thin-film magnetic heads to increase the number ofthin-film magnetic heads to obtain.

It is a second object of the invention to provide a thin-film magnetichead material and a method of manufacturing the same and a method ofmanufacturing thin-film magnetic heads to fabricate thin-film magneticheads in which no conductors connected to elements for detecting anamount of processing remain.

A thin-film magnetic head material of the invention includes: aplurality of rows of head-to-be sections to be thin-film magnetic heads;an inter-row cutting section provided to be a position at which adjacentones of the rows are to be separated; and an intra-row cutting sectionprovided to be a position at which adjacent ones of the head-to-besections in each of the rows are to be separated. The head materialcomprises: a detection element to be used for detecting an amount ofprocessing when specific processing is performed on the head material;an electrode formed in the inter-row cutting section for electricallyconnecting the detection element to an external device; and a conductorfor electrically connecting the electrode to the detection element.

In the thin-film magnetic head material of the invention, the electrodeconnected to the detection element is formed in the inter-row cuttingsection. As a result, the pitch of the head-to-be sections in each rowis reduced.

In the head material the detection element and the conductor may beformed in the intra-row cutting section. In this case, the detectionelement and the conductor are eliminated when the head material is cutoff at the intra-row cutting section.

A method of the invention is provided for manufacturing a thin-filmmagnetic head material including: a plurality of rows of head-to-besections to be thin-film magnetic heads; an inter-row cutting sectionprovided to be a position at which adjacent ones of the rows are to beseparated; an intra-row cutting section provided to be a position atwhich adjacent ones of the head-to-be sections in each of the rows areto be separated. The method includes the steps of providing a detectionelement to be used for detecting an amount of processing when specificprocessing is performed on the head material, an electrode forelectrically connecting the detection element to an external device, anda conductor for electrically connecting the electrode to the detectionelement; and forming the electrode in the inter-row cutting section.

According to the method of the invention, the electrode connected to thedetection element is formed in the inter-row cutting section. As aresult, the pitch of the head-to-be sections in each row is reduced.

In the method the detection element and the conductor may be formed inthe intra-row cutting section. In this case, the detection element andthe conductor are eliminated when the head material is cut off at theintra-row cutting section.

A method of manufacturing thin-film magnetic heads of the invention isperformed through the use of a thin-film magnetic head materialincluding: a plurality of rows of head-to-be sections to be thin-filmmagnetic heads; an inter-row cutting section provided to be a positionat which adjacent ones of the rows are to be separated; an intra-rowcutting section provided to be a position at which adjacent ones of thehead-to be sections in each of the rows are to be separated. The methodincludes the steps of: fabricating the head material including: adetection element to be used for detecting an amount of processing whenspecific processing is performed on the head material, an electrodeformed in the inter-row cutting section for electrically connecting thedetection element to an external device, and a conductor forelectrically connecting the electrode to the detection element;performing the specific processing on the head material while monitoringan output signal of the detection element obtained through theelectrode; forming a head aggregate including one of the rows of thehead-to-be sections by separating the head material having gone throughthe step of performing the processing at the inter-row cutting section;and forming the thin-film magnetic heads by separating the headaggregate formed in the step of forming the head aggregate at theintra-row cutting section.

According to the method of manufacturing thin-film magnetic heads of theinvention, the head material in which the electrode connected to thedetection element is formed in the inter-row cutting section in the stepof fabricating the head material. The specific processing is performedon the head material while an output signal of the detection elementobtained through the electrode is monitored in the step of performingthe processing. In the step of forming the head aggregate, the headaggregate is formed by separating the head material having gone throughthe step of performing the processing at the inter-row cutting section.The thin-film magnetic heads are formed by separating the head aggregateat the intra-row cutting section in the step of forming the heads.

In the method the detection element and the conductor may be formed inthe intra-row cutting section in the step of fabricating the headmaterial. In this case, the detection element and the conductor areeliminated when the head aggregate is cut off at the intra-row cuttingsection in the step of forming the heads.

Other and further objects, features and advantages of the invention willappear more fully from the following description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an explanatory view for illustrating part of a wafer as athin-film magnetic head material of an embodiment of the invention.

FIG. 2 is a flowchart for illustrating manufacturing steps of the waferof the embodiment.

FIG. 3 is a cross section of a thin-film magnetic head element portionin the wafer of the embodiment.

FIG. 4 is a cross section of a neighborhood of a detection element fordetecting an amount of processing in the wafer of the embodiment.

FIG. 5 is an explanatory view for illustrating a manufacturing processof the detection element, electrodes and leads for monitoring of theembodiment.

FIG. 6 is an explanatory view for illustrating the manufacturing processof the detection element, electrodes and leads for monitoring of theembodiment.

FIG. 7 is an explanatory view for illustrating the manufacturing processof the detection element, electrodes and leads for monitoring of theembodiment.

FIG. 8 is an explanatory view for illustrating the wafer and a waferblock.

FIG. 9A and FIG. 9B are perspective views for illustrating the step ofjoining the wafer block to a support plate of the embodiment.

FIG. 10 is a block diagram of an example of a lapping apparatus of theembodiment.

FIG. 11 is an explanatory view for illustrating repetition of aprocessing step and a head aggregate forming step of the embodiment.

FIG. 12 is an explanatory view for illustrating the step of formingthin-film magnetic heads of the embodiment.

FIG. 13 is an explanatory view for illustrating an example ofarrangement of detection elements for detecting an amount of processing,electrodes and leads for monitoring in a wafer used for manufacturingthin-film magnetic heads of related art.

FIG. 14 is an explanatory view for illustrating another example ofarrangement of detection elements, electrodes and leads for monitoringin a wafer used for manufacturing thin-film magnetic heads of relatedart.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

A preferred embodiment of the invention will now be described in detailwith reference to the accompanying drawings.

FIG. 1 shows part of a wafer as a thin-film magnetic head material ofthe embodiment of the invention. In the wafer 1 a plurality of rows ofhead-to-be sections 2 to be thin-film magnetic heads are aligned. Thewafer 1 includes inter-row cutting sections 3 each provided to be aposition at which adjacent ones of the rows are to be separated andintra-row cutting sections 4 provided to be a position at which adjacentones of the head-to-be sections are to be separated in each row.

In each head-to-be section 2 a thin-film magnetic head element 11 isformed. Each head element 11 has: an element section 12 including aninduction-type magnetic transducer and an MR element; and a plurality ofelectrodes 13 for connecting the element section 12 to an externaldevice.

In the wafer 11 a detection element 15 for detecting an amount ofprocessing is formed near the medium-facing-surface-side end of eachintra-row cutting section 4. In the wafer 11 electrodes 16 a and 16 bfor monitoring are formed in each inter-row cutting section 3 forelectrically connecting each detection element 15 to an external device.Furthermore, in the wafer 11 two leads 17 a and 17 b for monitoring areformed in each intra-row cutting section 4 as conductors forelectrically connecting each detection element 15 to the respectiveelectrodes 16 a and 16 b. The detection element 15 may be a resistanceelement whose resistance value changes in response to its dimensions.

Reference is now made to FIG. 2 to FIG. 7 to describe a method ofmanufacturing a thin-film magnetic head material of this embodiment,that is, a method of manufacturing the wafer 1 shown in FIG. 1. FIG. 2is a flowchart showing manufacturing steps of the wafer 1. FIG. 3 is across section of the thin-film magnetic head element 11 in the wafer 11.FIG. 4 is a cross section showing a neighborhood of the detectionelement 15 in the wafer 1. FIG. 5 to FIG. 7 show a manufacturing processof the detection element 15, the electrode 16 (that represents 16 a and16 b) for monitoring and the lead 17 (that represents 17 a and 17 b) formonitoring.

According to the manufacturing steps of the wafer 1, an insulating film73 made of alumina (Al₂O₃), for example, is formed on a substrate 72made of aluminum oxide and titanium carbide (Al₂O₃—TiC), for example(step S101). Next, a bottom shield layer 74 for a reproducing head isformed on the insulating film 73 (step S102). A shield gap film 75 madeof alumina, for example, is then formed on the bottom shield layer 74(step S103). Next, an MR element 76 for reproduction is formed on theshield gap film 75. At the same time, the detection elements 15 isformed on the shield gap film 75, as shown in FIG. 4 and FIG. 5 (stepS104).

Next, two leads (not shown) are formed on the shield gap film 75 and theMR element 76 such that one end of each of the leads is connected to theMR element 76. At the same time, as shown in FIG. 4 and FIG. 6, the twoleads 17 (17 a and 17 b) are formed on the shield gap film 75 and thedetection element 15 such that one end of each of the leads iselectrically connected to the detection element 15 (step S105).

Next, a shield gap film 77 is formed on the shield gap film 75 and theMR element 76 (step S106) and the MR element 76 is embedded in theshield gap films 75 and 77. A top shield-cum-bottom pole 78 is thenformed on the shield gap film 77 (step S107). Next, a recording gaplayer 79 made of alumina, for example, is formed on the topshield-cum-bottom pole 78 (step S108). A thin-film coil 81 is formed ina photoresist layer 80 on the recording gap layer 79 (step S109). Next,a top pole 82 is formed on the photoresist layer 80 (step S110). A rearportion of the top pole 82 (on the right side of FIG. 3) is in contactwith the bottom pole 78 and magnetically coupled thereto.

Next, a bump (an electrode) not shown that is connected to the MRelement 76 and a bump not shown that is connected to the thin-film coil81 are formed. At the same time, as shown in FIG. 4 and FIG. 7, bumps160 to be the electrodes 16 (16 a and 16 b) for monitoring are formedsuch that bottom ends of the bumps 160 are electrically connected to theleads 17 (17 a and 17 b) for monitoring (step S111). Next, a protectionlayer 83 made of alumina, for example, is formed to cover the top pole82 (step S112). The bumps are covered with the protection layer 83.Finally, the top surface of the protection layer 83 is polished and thebumps are exposed (step S113).

A method of manufacturing thin-film magnetic heads of the embodimentwill now be described. A first step of the method is to fabricate thewafer 1, which is described above. In the method of manufacturingthin-film magnetic heads, a specific processing is then performed on thehead-to-be sections 2 in the wafer 1. In this embodiment this processingis performed through the use of a wafer block 21 separated from thewafer 1 as shown in FIG. 8. The wafer block 21 includes a plurality ofrows of head-to-be sections 2 and the inter-row cutting sections 3 andthe intra-row cutting sections 4. Therefore, the wafer block 21corresponds to the thin-film magnetic head material of the invention,too.

The method of manufacturing thin-film magnetic heads includes: aprocessing step for performing the specific processing on the waferblock 21 while monitoring an output signal of the detection element 15that is obtained through the electrode 16; a head aggregate forming stepfor forming a head aggregate (that may be called a bar) in which a rowof head-to-be sections 2 are aligned by cutting the wafer block 21having gone through the processing step at the inter-row cuttingsections 3; and a head forming step for forming thin-film magnetic headsby cutting the head aggregate obtained through the head aggregateforming step at the intra-row cutting sections 4.

Reference is now made to FIG. 9A and FIG. 9B, and FIG. 10 to FIG. 12 todescribe the steps mentioned above. First, before the processing step,as shown in FIG. 9A, the wafer block 21, a support plate 22 forsupporting all the head-to-be sections of the wafer block 21, and adummy block 23 for assisting in supporting the wafer block 21 areprepared and they are joined to one another as shown in FIG. 9B. To bespecific, the wafer block 21 is placed on the support plate 22 such thatthe surface of the wafer block 21 including surfaces of all thehead-to-be sections faces the top surface of the support plate 22. Onthe support plate 22, the dummy block 23 is placed on the side of thewafer block 21 opposite to a medium facing surface 21 a. The surface ofthe wafer block 21 and the surface of the support plate 22 facing eachother, the surface of the wafer block 21 and the surface of the dummyblock 23 facing each other, and the surface of the dummy block 23 andthe surface of the support plate 22 facing each other, are bonded toeach other with an adhesive, respectively. When joined to the supportplate 22, the wafer block 21 is placed such that the surface opposite tothe surface in which the head elements 11 are formed faces the supportplate 22.

In the processing step, specific processing is performed on the mediumfacing surfaces of a row of head-to-be sections in the medium facingsurface 21 a of the wafer block 21 joined to the support plate 22. Inthis step, grinding using a grinding apparatus, lapping using a lappingapparatus and so on are performed. The MR height and the throat heightare thereby precisely defined.

FIG. 10 is a block diagram showing an example of the configuration of alapping apparatus. The apparatus comprises: a lapping plate 31; arotation driver 32 for driving the lapping plate 31 to rotate; anactuator 33 for holding the wafer block 21 such that the position of theblock 21 is changeable on the lapping plate 31 and for allowingadjustment of pressure applied to each part of the wafer block 21; anelectric signal processor 34 for receiving an output signal of eachdetection element 15 obtained through the electrodes 16 in a row locatedin the medium facing surface of the wafer block 21 and for performingspecific processing on the signal to output; and a controller 35 forcontrolling the rotation driver 32 and for receiving the output signalof the processor 34 and controlling the actuator 33 in response to theoutput signal.

In the lapping apparatus the controller 35 monitors an output signal ofeach detection element 15 obtained through the electrodes 16, andadjusts pressure applied to each part of the wafer block 21 in responseto the output signal. Through this operation the medium facing surfaceof the wafer block 21 is lapped while the straightness of the pattern ofthe thin-film magnetic head elements located in the medium facingsurface of the wafer block 21. The MR heights and throat heights of thehead elements in the row are precisely defined.

Next, in the head aggregate forming step, the wafer block 21 and thesupport plate 22 are cut together at the inter-row cutting section 3such that the head aggregate including the row of head-to-be sectionswhose medium facing surfaces have received the specific processing isseparated from the wafer block 21. The wafer block 21 and the supportplate 22 having been cut and the head aggregate having been obtained,processing of the medium facing surface and cutting of the wafer block21 and the support plate 22 are repeated as long as the wafer blocks 21remain. Processing markers that indicate the inter-row cutting sections3 are provided on the surface of the wafer block 21 in which thethin-film magnetic head elements are formed. The cutting position isdetermined with reference to the marker when the wafer block 21 and thesupport plate 22 are cut.

FIG. 11 illustrates repetition of the processing step and the headaggregate forming step described above. The top figure of FIG. 11illustrates processing of the medium facing surface of the wafer block21 bonded to the support plate 22. This processing having completed, thewafer block 21 and the support plate 22 are cut together so that thehead aggregate including the row of head-to-be sections whose mediumfacing surfaces have been processed are separated from the wafer block21, as shown in the figure in the middle of FIG. 11. The head aggregate51 and the piece 52 of the support plate 22 thereby obtained aretransferred to the post-step, as shown in the bottom figure of FIG. 11.If any wafer block 21 remains, processing of the medium facing surfaceis repeated as shown in the top figure of FIG. 11.

Next, the head aggregate 51 and the piece 52 of the support plate 22 areseparated from each other. Rails are formed in the medium facing surfaceof the head aggregate 51.

Next, in the thin-film magnetic head forming step as shown in FIG. 12,the head aggregate 51 is cut at the intra-row cutting sections 4 toseparate the head-to-be sections 2 from one another. Thin-film magneticheads are thus obtained.

According to the embodiment described so far, the electrodes 16 formonitoring connected to the detection elements 15 are formed in theinter-row cutting sections 3 in the wafer 1. As a result, the pitch ofthe head-to-be sections 2 in each row is reduced while high-precisionprocessing is achieved through the detection elements 15 for detectingan amount of processing. The number of thin-film magnetic heads obtainedis thus increased.

According to the embodiment, the detection elements 15 and the leads 17for monitoring are formed in the intra-row cutting sections 4. As aresult, it is possible to manufacture thin-film magnetic heads in whichthe leads 17 connected to the detection elements 15 do not remain. It istherefore possible to prevent the adverse effects such as the leadscatching noises or causing static damage.

The invention is not limited to the embodiment described above but maybe practiced in still other ways. For example, in the embodiment, thewafer block 21 separated from the wafer 1 is bonded to the support plate22 together with the dummy block 23. In this state, processing on themedium facing surface and cutting of the head aggregate are performed.Alternatively, the end face of the wafer block 21 opposite to the mediumfacing surface may be bonded to a specific jig and processing on themedium facing surface and cutting of the head aggregate may beperformed. Another alternative is to perform processing on the mediumfacing surface and cutting of the head aggregate in the state of thewafer 1.

According to the thin-film magnetic head material, the method ofmanufacturing the same, or the method of manufacturing thin-filmmagnetic heads of the invention described so far, the electrodeconnected to the detection element for detecting an amount of processingare formed in the inter-row cutting section. As a result, the pitch ofthe head-to-be sections in each row is reduced and the number ofthin-film magnetic heads obtained is increased.

According to the thin-film magnetic head material, the method ofmanufacturing the same, or the method of manufacturing thin-filmmagnetic heads of the invention, the detection element and the conductormay be formed in the intra-row cutting section. In this case, it ispossible to manufacture thin-film magnetic heads in which the conductorconnected to the detection element does not remain.

Obviously many modifications and variations of the present invention arepossible in the light of the above teachings. It is therefore to beunderstood that within the scope of the appended claims the inventionmay be practiced otherwise than as specifically described.

What is claimed is:
 1. A method of manufacturing a thin-film magnetichead material, the head material including: a plurality of rows ofhead-to-be sections to be thin-film magnetic heads; an inter-row cuttingsection provided to be a position between adjacent ones of the rows thatare to be separated; and an intra-row cutting section provided to be aposition between adjacent ones of the head-to-be sections in each of therows that are to be separated; the method comprising: providing adetection element to be used for detecting an amount of processing whenspecific processing is performed on the head material; an electrode forelectrically connecting the detection element to an external device; anda conductor for electrically connecting the electrode to the detectionelement, wherein: the detection element is not disposed in the inter-rowcutting section but disposed in each of the rows; and the electrode isnot disposed in each of the rows but disposed in the inter-row cuttingsection.
 2. The method according to claim 1, wherein the detectionelement and the conductor are formed in the intra-row cutting section.